Model
|
– HBFBZ10-6412-B
– HBFBZ10I-6412-B
– HBFBZ10-6412-E (EMMC)
– HBFBZ10I-6412-E (EMMC)
– HBFBZ10-6412-T (EMMC&TPM;)
– HBFBZ10I-6412-T (EMMC&TPM;)
|
CPU/Chipset
|
– Intel® Elkhart Lake SoC Processor (J6412) |
BIOS
|
– AMI Flash ROM |
Memory
|
– 1* DDR4 3200MHz SO-DIMM up to 16GB |
Network
|
– 4* Intel i255V 2.5GbE |
Graphics
|
– Intel® HD Graphics, shared memory
– 1* HDMI 2.0 (Max Resolution: 4096×2160@60Hz) |
Storage
|
– 1* M.2 M-key (2242, PCIe Gen.3 x2/SATA interface) support NVME, (co-layout M.2 B-key) |
Expansion slot
|
– 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface)
– 1* M.2 B-key (3042/3052, USB3.1 interface) co-layout M.2 M-key
(If you use M.2 B-key type-3042/3052 card, M.2 M-key type-2242 is not available; vice versa) |
Rear Panel I/O
|
– 4* RJ45
– 1* COM (RJ45 type)
– 1* DC-in jack |
Front Panel I/O
|
– 1* Power button + Power LED
– 1* Reset
– 1* USB3.1
– 1* USB2.0
– 1* HDMI (Max. 4096×2160@60Hz resolution) |
Internal Connector
|
– 32GB eMMC onboard (by model)
– 1* SIM card holder |
Compliance
|
– CE, FCC, RoHS, ErP Ready |
Power Source
|
– MB : DC12V input
– Adapter : AC 90~240V input / DC12V-3.3A-40W output |
Compliance
|
– CE, FCC, LVD, RoHS, ErP Ready |
Temperature
|
– Operating Temperature: -20 ~ 60° C (Under the condition of using M.2 interface SSD)
– Storage Temperature: -20 ~ 80° C
– Humidity: Between 40% and 60%, non-condensing |
Dimensions
|
– System: 125 (W) x 109 (D) x 39.5 (H) mm |
OS Support
|
– Windows 10, Windows 11, Linux |